Saras Micro Devices is Powering the Future
Meeting Your Power Delivery and Efficiency Challenges
The explosive growth of data is fueling demand for leading-node high-performance computing (HPC) devices. However, power delivery and efficiency challenges are constraining scaling of processor and accelerator performance to meet this demand.
Saras Micro Devices is addressing these challenges by transforming the way power is delivered to advanced semiconductor devices to maximize the computing power for cutting-edge applications like high-performance computing (HPC), artificial intelligence (AI), virtual reality (VR), 5G networking and more. Formed in 2021 by an impressive team of experienced and well-known advanced packaging experts , we have developed a novel approach for improving power delivery performance that uses 25% less package space, provides clean stable power, and minimizes power waste to deliver better overall efficiency. Our passive 3D integrated and centralized power delivery module is embedded in the package substrate core to improve per-watt performance and reduce the power path inside a smaller footprint.
When you need packaging expertise to help you reach your power management goals, we’re there to help you power your cutting-edge solutions. We not only understand your manufacturing roadblocks, issues, and frustrations, but we also have a technology that can unleash your device potential and free up space for additional functionality or compute power. You can trust that we’ll do our part to enable greater power efficiency and new possibilities for your devices.