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    Technical Resources for Advanced Power Delivery​

    High-performance computing and AI accelerators are reaching hard limits at the package level. Rising current density, tighter footprints and more power rails per device are making traditional power delivery networks harder to design and control.
    Saras Micro Devices addresses these challenges with its STILE technology. The Saras Tile, or STILE, is a multi-domain, substrate-embedded passive module that brings passives into the package to support the growing number of power rails in advanced SoCs and accelerator cards.

    By moving power regulation from the system board into the package and enabling vertical power delivery, STILE shortens power paths, reduces routing losses and helps designers improve power integrity for demanding AI, ML, AR/VR, 5G and 6G workloads.

    Download Saras’ technical resources to see how STILE:
    • Increases capacitance density and improves package-level PDN performance
    • Supports custom and standard integrated passive modules for HPC and AI systems
    • Frees package real estate to enable higher levels of chiplet integration
    • Scales across multiple deployment options in and around the package
    Available resources
    • Published white papers and presentations that Saras has not given up rights to
    • Technical data sheets
    • Drawings
    • Application notes

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