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Ron Huemoeller

Chief Executive Officer

Ron Huemoeller provides leadership, strategy, and technical direction to position Saras for short- and long-term success. He brings 35+ years of senior/executive management experience in semiconductor packaging and technology. At Amkor Technology he served as Corporate Vice President, leading Global R&D and Technology Strategy for five years. In this role, he developed new products and business opportunities, launching more than 250 new products into production generating over $2B in new annual revenue, while reducing time-to-market by more than 50%. Mr. Huemoeller previously held other executive roles at Amkor Technology, was a Managing Director at Applied Materials for its newly formed Packaging Business Unit and was Director/Head Engineer of the Printed Circuit Operations at Cray Computer Corporation.

Mr. Huemoeller has authored/co-authored chapters in two semiconductor handbooks on Advanced Packaging (Handbook of 3D Stacking (2011 McGraw Hill) and Embedded Die & Wafer Level Packaging Technologies (2018 Wiley)). He has been granted more than 250 U.S. patents and was President/Past President of the International Microelectronics Assembly and Packaging Society (IMAPS), positions he held from 2016-2020. He holds a B.S. in Chemistry from Augsburg University (MN), graduating with highest honors, an MBA from Arizona State University and a Master’s in Technology Management from the University of Phoenix.